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  CMT-SR5000 (Auto mapping system for 300/450mm wafer)
1. Introduction
  CMT-SR5000은 Current source와 Probe contact system일체형으로, 단독측정은 물론, 300/450mm Wafer의 면저항을 PC와 전용 S/W를 이용하여 자동으로 측정하고, 2D 및 3D로 분석가능합니다.  
2. Features  
XYZ-axis fully automatic system  
High precision JANDEL 4-point probe head  
Automatic range selection  
Systems for 300/450mm wafer  
Built-in temp sensor for temp coefficient  
Perfect remote control by operating software  
Data analysis. (2D, 3D mapping / Data map etc.)
ASTM, SEMI measurement mode    
High precision movement    
3. Configuration    
  The system consists of the following components.    
JANDEL 4-point probe head unit    
XYZ-axis robot arm    
300/450mm sample stage chuck    
Remote control communication USB port    
Membrane keyboard panel & LCD display window    
Power switch in Front panel    
Operating & analysis software    
Vacuum hose connector    
Standard accessories    
  - Operating PC
- Power cable & USB cable for Remote control
- AIT reference 3" wafer
- Operating & service manual
   
4. Specifications    
Sheet resistance measurement    
  - Measuring method : Contacted by four point probe
- Measuring range : 1 mohm/sq ∼ 2 Mohm/sq
   
Resistivity measurement    
  - Measuring method : Contacted by 4-point probe (input thickness)
- Measuring range : 10.0 μohm·cm ∼ 200.0 kohm·cm
Current source    
  - 10nA to 100mA
- DVM 0V to 2,000mV
   
Measurement accuracy    
  - ±0.5 %(Precision resistor)    
JANDEL 4-point probe    
  - Pin spacing : 25 mils ∼ 50 mils by 5mil increments
- Pin Load : 10 gram ∼ 250 gram/pin
- Pin radius : 12.5 micron∼500 micron (polished 2μ diamond)
- Tolerance : ± 0.01 mm
- Needles : Solid Tungsten Carbide φ0.40 mm
Operating software    
  - Measurement condition creation : Wafer type, measure point interval, test mode, etc.
- Save & load : Data, wafer type, measure point
- Data analysis : 2D, 3D mapping, Data map, etc.
- Data & mapping printout
   
Measurement mode (S/W)    
  - Auto measurement : Point interval designation by user
- Quick measurement : ASTM, SEMI Mode
- Point measurement : Appointment on wafer by mouse
- Manual measurement : Appointment on wafer by arrow key
5. Specimen    
  - Wafer : max 300 or 450mm (Option)
     
6. Measuring time    
  - Approx. 2 ± 1 sec / point    
7. Software (Windows Ver.)
Operating personal computer : IBM PC/AT Compatible PC
USB communication
8. Utility requirements    
Power requirements    
  - Line voltage : AC 220V ± 10%
- Electric power : 100 W, 500 mA
- Line frequency : 60 Hz
   
Compressed Dry Air (CDA)    
  - Size : 6mm
- Press : 1.500mmHg
   
Process vacuum    
  - Size : 4mm
- Press : 200mmHg
   
9. Outside Dimension    
300mm system:580mm(W)×700mm(D)×430mm(H)    
450mm system:610mm(W)×770mm(D)×430mm(H)    
10. Operating environment    
Temperature range : 23°± 1°C    
Relative humidity : 30 % ∼ 70 %    
Avoid placing the system near a source of RFI, vibration and sources of gas.
Avoid large changes in temperature.    
       
 
 
     
   
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